Includes bibliographical references and index.
|Statement||edited by Tai-Ran Hsu.|
|Series||EMIS processing series -- no. 3.|
|Contributions||Hsu, Tai-Ran., INSPEC.|
|The Physical Object|
|Pagination||xxix, 275 p. :|
|Number of Pages||275|
Written as a collective work by 14 outstanding microsystems packaging specialists from US industries, government laboratories and universities, MEMS Packaging provides a comprehensive view of the prevalent practices and enabling techniques in the assembly, packaging and testing of MEMS and microsystems. The book also addresses aspects of microassembly and testing technologies that are 5/5(1). MEMS Packaging (WSPC Series in Advanced Integration and Packaging Book 5) - Kindle edition by Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss, Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss. Download it once and read it on your Kindle device, PC, phones or tablets. Use features like bookmarks, note taking and highlighting while reading MEMS Packaging (WSPC Series in Advanced Integration and Packaging Book 5/5(1). While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the. MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and mircrosystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered.
The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. An overview of the through-substrate vias (TSVs), the associated fabrication techniques and their applications in MEMS and electronic packaging have been presented in this chapter. TSVs are being used in interconnection and 3-D packaging of micro-electro-mechanical-systems (MEMS) and electronic devices. McGraw-Hill recently published his 7th book, MEMS and MOEMS Packaging. Ken is president of ET-Trends LLC, a consulting and intellectual property firm focused on emerging technologies and device packaging. He is an active member of IEEE and Vice President of Technical Programs for the Surface Mount Technology Association (SMTA). packaging. The complexity of MEMS is also shown in the extensive range of markets and applications that incorporate MEMS devices. MEMS can be found in systems ranging across automotive, medical, electronic, communication and defence applications. Current MEMS.
From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.4/5(3). The Internet of Things and MEMS packaging By Vik Chaudhry, Adrian Arcedera [Amkor Technology, Inc.] any experts regard the Internet of Things (IoT) as the third wave of technology. The personal computer (PC) created the first wave in the late 80s and early 90s. The cell phone initiated. MEMS structures are generally very fragile, have moving structures, and must interface with the environment. The requirements for packaging are application specific and differ from each other, thus standard MEMS packaging protocols are difficult to establish, leading to an increase in product cost. An Introduction to Microelectromechanical Systems Engineering by N. Maluf Review: Maluf gives a good introduction to MEMS manufacturing and applications. The book easy and inspiring to read. The level of treatment is almost non-technical: After reading this book, you will understand how MEMS devices work and how they are manufactured.